EAHP3535GA0

$2.09
Tax excluded

Description

This part series is a surface-mount high-power device featuring high brightness combined with a compact size that is suitable for all kinds of lighting applications such as general illumination, flash, spot, signal, industrial and commercial lighting. The thermal pad of this device is electrically isolated providing convenience in thermal and electrical design. This part series is one of the most promising devices in Everlight Americas high power product offering and is ready to face the challenges of today’s Solid-State Lighting requirements.

Features

  • LM-80 Certified Small package with high efficiency ESD protection up to 8KV Soldering method: SMT Binning Parameters: Brightness, Forward Voltage ,Wavelength and Chromaticity Moisture Sensitivity Level: 1 RoHS compliant Matches ANSI binning

Applications

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EAHP3535GA0
Forward Current
350mA
Forward Voltage
3.85V
Pulsed Forward Current
1000mA
Beam Angle
120 deg.
Mounting
SMD
Operating Temperature
-40°C to 100°C
Storage Temperature
-40°C to 100°C
Thickness
2mm